教育经历：

2006-2009：天津大学，材料加工工程专业，博士
2004-2006：天津大学，材料加工工程专业，硕士
2000-2004：河北科技大学，材料成型及自动化专业，学士

工作经历：

2011-至今：电子科技大学，机械与电气工程学院，副教授
2014-2015：加拿大滑铁卢大学，先进材料连接中心，访问学者
2009-2011：电子科技大学，机械与电气工程学院，讲师

研究方向：

1、先进制造技术（激光加工、增材制造）
2、数值仿真与建模（材料成型、结构优化、工艺分析）

研究项目与课题：

2018-2021 国家自然科学基金项目No.51775091， 负责人
2018-2019 四川省科技计划项目No.18ZDYF2563， 负责人
2017-2019 “十三五”装备预研领域基金No.61409230501， 负责人
2018-2020 四川省产学研项目No.2017jxw021， 负责人
2017-2019 四川省产学研项目No.2017jxw012， 负责人
2016-2018 广东省科技计划项目No.2016A010102002，负责人

代表性学术成果：

1. Deng, XH; Z, Zeng*; Peng, B; Yan, S; Ke, WC. Mechanical Properties Optimization of Poly-Ether-Ether-Ketone via Fused Deposition Modeling. Materials. 2018. 11, 216.
2.   Zeng, Z*; Oliveira, JP; Bu, XZ; Yang, M; Li, RX; Wang, ZM. Laser Welding of BTi-6431S High Temperature Titanium Alloy. Metals. 2017,7,504
3.  Zeng, Z*; Oliveira, JP; Yang, M; Song, D; Peng, B. Functional fatigue behavior of NiTi-Cu dissimilar laser welds. Materials & Design. 2017, 114(15): 282-287.
4.  Oliveira, JP*; Zeng, Z; Andrei, C; Fernandes, FMB; Miranda, RM; Zhou, N. Dissimilar laser welding of superelastic NiTi and CuAlMn shape memory alloys. Materials & Design. 2017, 128(15): 166-175.
5.  Zeng, Z*; Wu, XY; Yang, M; Peng, B. Welding distortion prediction in 5A06 aluminum alloy complex structure via inherent strain method. Metals. 2016, 6, 214.
6.  Zeng, Z*; Yang, M; Oliveira, JP; Song, D; Peng, B. Laser welding of NiTi shape memory alloy wires and tubes for multi-functional design applications. Smart Materials and Structures. 2016, 25:085001.
7.  Oliveira, JP*; Zeng, Z; Omori, T; Zhou, N; Miranda, RM; Fernandes, FMB. Improvement of damping properties in laser processed superelastic Cu-Al-Mn shape memory alloys. Materials & Design. 2016, 98:280-284.
8.  Huang, B; Li, XB; Zeng Z*; Chen, NB. Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector. Microelectronics Reliability. 2016,66: 106-112.
9.   Zeng, Z*; Panton, B; Oliveira, JP; Han, A; Zhou, YN. Dissimilar laser welding of NiTi shape memory alloy and copper. Smart Materials and Structures. 2015, 24(12): 125036.
10.   Guo, W; Zeng, Z*; Zhang, XY; Peng, P; Tang, SP. Low-temperature sintering bonding using silver nanoparticle paste for electronics packaging. Journal of Nanomaterials. 2015,2:1-7.

荣誉与奖励：